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                Micrometer wire of diamond 150 (silicon wafer slicing)

                date:2015-06-23 13:25  hits:  size【big | normal | small

                1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high.
                2. Lost of kerf is low with high capacity.
                3. Cutting technique is stable and wafer is even.
                4. Reject of cut silicon is recyclable and cost is low.